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SOT-23 FCOL Package Thermal Considerations \| Richtek Technology a thermal image simulation of a wire-bond SOT-23-6 package in a buck converter application Design Support ▶ Technical Documentation ▶ SOT-23 FCOL Package Thermal Considerations
Understanding Thermal Characteristic of SOT-223 Package \| Richtek Technology Finally, we will introduce the thermal analysis of PCB copper layout for SOT-223 package 设计支持 ▶ 技术文件 ▶ Understanding Thermal Characteristic of SOT-223 Package
Footprint for SOT,SOT-26(COL) https://www.richtek.com/assets/podfiles/Footprint-TSOT-26 TSOT-26(FC) SOT-26 SOT-26(C0L)-R-A.pdf
Footprint for Flip Chip TSOT,SOT-563(FC) P1 A B C D M SOT-563(FC) 6 0.50 2.42 1.02 0.70 0.30 1.30 ±0.10 Package Tolerance Footprint https://www.richtek.com/assets/podfiles/Footprint-SOT-563(FC)-R-A.pdf
Footprint for SOT,SOT-143 P1 A B C D D1 M SOT-143 4 1.90 3.30 1.30 1.00 0.60 1.03 2.50 ±0.10 Package Tolerance https://www.richtek.com/assets/podfiles/Footprint-SOT-143.pdf