8
8
8
4
16
16
16
16
rt-dark-900
Reliability Test
bannerTitle
16
16
16
16
rt-dark-900
By strictly following JEDEC standards for product and package reliability, we ensure unmatched stability durable under a wide range of environmental conditions.
bannerDescription
32
32
32
32
width
fixed-width
backgroundImage
altText
Quality Reliability Banner
enableMask
false
maskGradient
dark
hideSection
false
32
32
32
16
- content-section
0
0
32
32
rt-dark-800
Reliability
32
32
32
16
rt-dark-800
Richtek conducts multiple reliability verifications for new products and new packages in accordance with JEDEC standards to ensure product stability and safety under various environmental conditions.
32
32
32
16
rt-blue-700
Product Reliability
16
16
16
16
32
32
32
16
rt-blue-700
Package Reliability
16
16
16
16
32
32
32
16
rt-dark-900
Product Reliability
16
16
16
16
16
16
32
16
rt-blue-700
1. HTOL (High Temperature Operating Life)
16
16
16
16
rt-blue-700
2. ESD (Electrostatic Discharge)
16
16
16
16
rt-light-blue-500
HBM（Human Body Model）
16
16
16
16
16
16
16
16
rt-light-blue-500
CDM（Charged Device Model）
16
16
16
16
rt-blue-700
3. Latch-Up
16
16
16
16
rt-dark-800
A common failure phenomenon in CMOS (Complementary Metal-Oxide-Semiconductor) integrated circuits. When parasitic elements (such as parasitic bipolar transistors) inside the IC are triggered, a low-resistance conduction path may form, causing a large current between the power supply and ground, which can lead to chip damage, malfunction, or even burnout.
16
16
16
16
16
16
16
16
rt-dark-900
Package Reliability
16
16
16
16
16
16
16
16
rt-blue-700
1. Preconditioning
16
16
16
16
rt-dark-800
Simulates thermal and moisture stress during assembly, allowing samples to undergo actual process conditions. Ensures subsequent tests accurately reflect product performance in real applications.
16
16
16
16
rt-blue-700
2. uHAST (Unbiased Highly Accelerated Stress Test)
16
16
16
16
rt-dark-800
Accelerates product aging in high temperature and high humidity environments without applying electrical bias. Evaluates the durability and reliability of package materials and structure.
16
16
16
16
rt-blue-700
3. TCT (Temperature Cycling Test)
16
16
16
16
rt-dark-800
Repeatedly cycles between high and low temperatures to simulate conditions of rapid temperature changes. Assesses the durability of package structure and solder joints.
16
16
16
16
rt-blue-700
4. HTST (High Temperature Storage Test)
16
16
16
16
rt-dark-800
Stores products at high temperatures for extended periods to evaluate thermal stability. Checks if materials fail due to aging under high temperature.
16
16
16
16
rt-blue-700
5. bHAST (Biased Highly Accelerated Stress Test)
16
16
16
16
rt-dark-800
Applies electrical bias in high temperature and high humidity environments to accelerate product aging. Tests product reliability under extreme operating conditions.
64
64
64
32