SemiDrive Technology has partnered with analog IC design company Richtek Technology to launch the SD210, a new reference design tailored for next-generation smart cockpit systems. Built on SemiDrive’s X9 series SoC platform and powered by Richtek’s RTQ2209 PMIC, along with other key power management components, the SD210 delivers a compact and highly efficient power solution to meet the diverse demands of advanced automotive applications.

Since 2023, the two companies have collaborated on smart cockpit innovations, beginning with the X9M/E platform powered by Richtek’s RTQ2209 and RTQ2102A . This early reference design has been successfully adopted by several major automotive manufacturers. The introduction of the SD210 marks the continued evolution of this partnership, offering improved power integration, streamlined system design, and enhanced safety and user experience for automotive infotainment platforms.

About the SD210 Reference Design

The SD210 reference design pairs SemiDrive’s X9H, X9HP, and X9SP smart cockpit SoCs with Richtek’s RTQ2209 SoC PMIC, the RTQ2134 multiphase step-down converter, the RTQ2102A synchronous step-down converter, and the RTQ2531A LDO. Embedded MTP/OTP memory enables flexible output voltage settings and sequencing control, allowing customizable power configurations. Pin compatibility across SoCs simplifies upgrades without circuit redesign, significantly accelerating development cycles.

Richtek’s RTQ2209-QA automotive-grade PMIC housed in a wettable flank 6x6 QFN package, integrates 10 configurable channels with I²C interface for flexible control. Featuring quiescent current as low as 50μA, it ensures minimal power consumption during Suspend to RAM (STR) mode, significantly improving efficiency and extending battery life. Richtek also offers the RTQ2134-QA , a 4-channel multiphase buck converter capable of delivering up to 20 A, addressing more performance-intensive automotive systems.

To support diverse cockpit system configurations, Richtek provides 4 optimized power solutions for X9SP, X9HP, and X9H platforms. These solutions leverage the high level of integration in the RTQ2209 to simplify circuit design, reduce PCB space, and streamline development, delivering power efficiency and compactness for the next-generation automotive cockpits.

Solution A: With MCU

Solution B: Without MCU

Solution A, Configuration 1: System with MCU and DRAM LP4

The power solution A is designed for systems based on the X9SP, X9H, or X9HP platforms equipped with an MCU and DRAM LP4 memory. This configuration integrates the RTQ2209 and RTQ2134 to deliver different power to the system. In this setup, the MCU controls both the RTQ2209 and RTQ2134 via GPIOs and the I²C interface. The RTQ2209 delivers power to RTC, SAF, DRAM, and GPU, while the RTQ2134 supplies core power to the AP and CPU.

▲ Solution A for X9SP Configuration 1

Solution A, Configuration 2: System with MCU and DRAM LP4x

The power solution A is also designed for systems based on the X9SP, X9H, or X9HP platforms equipped with an MCU and DRAM LP4x memory in a different configuration. The configuration integrates 3 devices including the RTQ2209, RTQ2134, and RTQ2102A. In this setup, the MCU manages all 3 power ICs via GPIOs and the I²C interface. The RTQ2209 supplies power to the RTC, SAF, GPU, and LP4x memory. The RTQ2134 provides core power for the AP and CPU, while the RTQ2102A delivers additional power to LP4x memory.

▲ Solution A for X9SP Configuration 2

Solution B, Configuration 3: System with DRAM LP4 only, without MCU

The power solution B is designed for systems based on the X9SP, X9H, or X9HP platforms without an MCU but with DRAM LP4 memory. The power system consists of 3 devices: RTQ2209, RTQ2134, and RTQ2531A. In this configuration, the X9SP/X9H/X9HP SoC controls the RTQ2209 and RTQ2134 via GPIOs and the I²C interface. The RTQ2209 supplies power to the SAF, DRAM, and GPU, the RTQ2134 supplies core power to the AP and CPU, and the RTQ2531A provides a dedicated power rail for the RTC.

▲ Solution B for X9SP Configuration 3

Solution B, Configuration 4: System with DRAM LP4x only, without MCU

This power solution B is also designed for systems based on the X9SP, X9H, or X9HP platforms without an MCU but with DDRAM LP4x memory. The configuration consists of 4 devices: RTQ2209, RTQ2134, RTQ2102A, and RTQ2531A. In this setup, the SoC controls the RTQ2209, RTQ2134, and RTQ2102A via GPIOs and the I²C interface. The RTQ2209 supplies power to the SAF, GPU, and LP4x. The RTQ2134 delivers core power to the AP and CPU, while the RTQ2102A provides additional power to the LP4x memory. Additionally, the RTQ2531A powers the RTC.

▲ Solution B for X9SP Configuration 4

SemiDrive’s X9 series supports a wide range of applications, including digital instrument clusters, IVI systems, central displays, and parking integration. It offers scalable solutions from entry-level to flagship vehicle models. Backed by a mature ecosystem and proven mass production capabilities, the series has now surpassed one million units shipped.

According to Q1 2025 data from Gasgoo Global Auto Research, based on China’s vehicle insurance registration, the X9 series ranked first among Chinese domestic brands in cockpit system for vehicles priced over NTD 400,000 (approx. RMB 100,000). The X9 series has been successfully adopted by leading automotive manufacturers such as SAIC, Chery, Changan, FAW, GAC, BAIC, Dongfeng Nissan, and Dongfeng Honda, and is now featured in over 50 mainstream vehicle models, including many exports. This demonstrates SemiDrive’s strong market penetration and growing competitive.

“We are honoured to once again collaborate with SemiDrive to provide comprehensive power management solutions for their X9 series platform,” said Brian Chu, Associate Vice President of Central Marketing at Richtek. “This close partnership is helping to drive innovation in smart cockpit systems while bringing new momentum to the new energy vehicle industry. We look forward to deepening our collaboration with SemiDrive and contributing to the next generation of vehicles.”

For more information about Richtek’s automotive products:

About Richtek

Richtek Technology Corporation is one of the world’s leading analog IC companies. Founded in 1998, the company is headquartered in Taiwan with additional offices in Asia, the U.S., and Europe. The company consistently delivers innovative power management solutions that improve the performance of consumer electronics, computers, communications equipment, industrial and automotive applications. Richtek adds value to end equipment by synthesizing technological innovation, uncompromised quality, and devotion to customer service. For more information, please visit Richtek’s website.

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About SemiDrive

SemiDrive is a leading provider of high-performance automotive-grade SoCs, with a strong focus on smart cockpit and vehicle control applications. Designed to meet the core demands of next-generation automotive requirements, all SemiDrive’s product lines are in mass production, with cumulative shipments exceeding 8 million units. The company has launched over 200 projects and serves more than 260 customers, covering over 90% of China’s major automotive manufacturers as well as several global manufacturers, including SAIC, Chery, Changan, Dongfeng, FAW, Nissan, Honda, Volkswagen, and Li Auto. For more information, please visit SemiDrive’s website.